ETCHING SOLUTION FOR COPPER OR COPPER ALLOY

PROBLEM TO BE SOLVED: To provide an etching solution for highly selectively etching copper or a copper alloy from an electronic substrate, in a stage of etching the copper or the copper alloy from the electric substrate simultaneously including the copper or the copper alloy and nickel simultaneousl...

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Hauptverfasser: KOMICHI YUKICHI, YOSHIDA YUTAKA
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creator KOMICHI YUKICHI
YOSHIDA YUTAKA
description PROBLEM TO BE SOLVED: To provide an etching solution for highly selectively etching copper or a copper alloy from an electronic substrate, in a stage of etching the copper or the copper alloy from the electric substrate simultaneously including the copper or the copper alloy and nickel simultaneously.SOLUTION: The etching solution is used for the stage of selectively etching the copper or the copper alloy from the electronic substrate simultaneously including the copper or the copper alloy and nickel, the solution being an etching solution for copper or a copper alloy comprising a chelating agent (A) having an acid group in a molecule, hydrogen peroxide (B), and a surfactant (C) having an oxyethylene chain in a molecule, as essential components.
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subjects CHEMICAL SURFACE TREATMENT
CHEMISTRY
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING MATERIAL WITH METALLIC MATERIAL
COATING METALLIC MATERIAL
DIFFUSION TREATMENT OF METALLIC MATERIAL
INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL
METALLURGY
MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE
title ETCHING SOLUTION FOR COPPER OR COPPER ALLOY
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