ETCHING SOLUTION FOR COPPER OR COPPER ALLOY

PROBLEM TO BE SOLVED: To provide an etching solution for highly selectively etching copper or a copper alloy from an electronic substrate, in a stage of etching the copper or the copper alloy from the electric substrate simultaneously including the copper or the copper alloy and nickel simultaneousl...

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Bibliographische Detailangaben
Hauptverfasser:	KOMICHI YUKICHI, YOSHIDA YUTAKA
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25 NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide an etching solution for highly selectively etching copper or a copper alloy from an electronic substrate, in a stage of etching the copper or the copper alloy from the electric substrate simultaneously including the copper or the copper alloy and nickel simultaneously.SOLUTION: The etching solution is used for the stage of selectively etching the copper or the copper alloy from the electronic substrate simultaneously including the copper or the copper alloy and nickel, the solution being an etching solution for copper or a copper alloy comprising a chelating agent (A) having an acid group in a molecule, hydrogen peroxide (B), and a surfactant (C) having an oxyethylene chain in a molecule, as essential components.