PRESSURE-SENSITIVE ADHESIVE TAPE

PROBLEM TO BE SOLVED: To provide a pressure-sensitive adhesive tape generating little contamination to an adherend, attaining compatibility between adhesive power and peelability, and producible by coextrusion molding.SOLUTION: The pressure-sensitive adhesive tape includes a pressure-sensitive adhes...

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Bibliographische Detailangaben
Hauptverfasser:	TORII TADAO, OYAMA TAKATERU, HABU TSUYOSHI, ASAI FUMITERU, KATO YUKI, TAKAHASHI TOMOKAZU, IKUSHIMA NOBUSUKE, KAMEI KATSUTOSHI
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a pressure-sensitive adhesive tape generating little contamination to an adherend, attaining compatibility between adhesive power and peelability, and producible by coextrusion molding.SOLUTION: The pressure-sensitive adhesive tape includes a pressure-sensitive adhesive layer and a base material layer, wherein: the pressure-sensitive adhesive layer contains an amorphous propylene-(1-butene) copolymer polymerized by using a metallocene catalyst; a weight-average molecular weight (Mw) of the propylene-(1-butene) copolymer is ≥200,000; a molecular weight distribution (Mw/Mn) of the propylene-(1-butene) copolymer is ≤2; and the base material layer contains an ethylene-vinyl acetate copolymer.