PACKAGE BAG

PROBLEM TO BE SOLVED: To provide a package bag that is capable of repetitive resealing by rolling up an unsealed opening of the package bag without providing an additional component.SOLUTION: The package bag includes a peripheral thermal adhesion part formed by mutually facing surfaces of thermally...

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Bibliographische Detailangaben
Hauptverfasser: KURIOKA HIROKAZU, TSUJIMOTO TAKAAKI, UENISHI SHINICHI, OKAZAKI NAHO
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a package bag that is capable of repetitive resealing by rolling up an unsealed opening of the package bag without providing an additional component.SOLUTION: The package bag includes a peripheral thermal adhesion part formed by mutually facing surfaces of thermally adhesive resin layers of laminated bodies formed by laminating a base material layer and the thermally adhesive resin layer via a hot melt adhesive layer, and hot gluing the periphery of the thermally adhesive resin layer. In the package bag, a half-cut part having a shape that is opened from the base material layer side is formed, and a non-formed part, where the hot melt adhesive layer is removed, is formed in an outer periphery of the peripheral thermal adhesion part.