SEALING MEMBER FOR ELECTRONIC COMPONENT PACKAGE, ELECTRONIC COMPONENT PACKAGE, AND METHOD FOR MANUFACTURING THE SEALING MEMBER FOR ELECTRONIC COMPONENT PACKAGE

PROBLEM TO BE SOLVED: To suppress the deterioration of the airtightness of an interior space in an electronic component package.SOLUTION: An electronic component package includes a first sealing member 4, in which electrodes 31 and 32 of an electronic component element 2 are mounted on one main surf...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	KODA NAOKI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS BASIC ELECTRONIC CIRCUITRY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS RESONATORS SEMICONDUCTOR DEVICES TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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