SEALING MEMBER FOR ELECTRONIC COMPONENT PACKAGE, ELECTRONIC COMPONENT PACKAGE, AND METHOD FOR MANUFACTURING THE SEALING MEMBER FOR ELECTRONIC COMPONENT PACKAGE

PROBLEM TO BE SOLVED: To suppress the deterioration of the airtightness of an interior space in an electronic component package.SOLUTION: An electronic component package includes a first sealing member 4, in which electrodes 31 and 32 of an electronic component element 2 are mounted on one main surf...

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Bibliographische Detailangaben
1. Verfasser:	KODA NAOKI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS BASIC ELECTRONIC CIRCUITRY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS RESONATORS SEMICONDUCTOR DEVICES TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To suppress the deterioration of the airtightness of an interior space in an electronic component package.SOLUTION: An electronic component package includes a first sealing member 4, in which electrodes 31 and 32 of an electronic component element 2 are mounted on one main surface 42, and a second sealing member 7 arranged so as to face the first sealing member 4 and hermetically sealing the electrodes 31 and 32 of the electronic component element 2. A conductive material fills a through hole 49, penetrating through both main surfaces 41 and 42 of a base material forming the first sealing member 4, and an opening end part (opening end part on the side of an opening surface 493) of the through hole 49 on the other main surface 43 of the first sealing member 4 is covered with a resin material (resin pattern 61).