HEAT TRANSFER BOARD

PROBLEM TO BE SOLVED: To provide a heat transfer board superior in heat transfer efficiency.SOLUTION: The heat transfer board 10 includes: a heat transfer board body 1 with a recess 1g on its surface; a tube 3 for a heat medium arranged in the recess 1g and having at least one outer circumference gr...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	SUGAWARA HIROMASA, YOSHIHARA TOSHIKAZU, KOBAYASHI HIDETAKA, SAWAGUCHI MASA
Format:	Patent
Sprache:	eng
Schlagworte:	BLASTING CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OFGENERAL APPLICATION HEAT EXCHANGE IN GENERAL HEATING LIGHTING MACHINE TOOLS MECHANICAL ENGINEERING METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WEAPONS WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a heat transfer board superior in heat transfer efficiency.SOLUTION: The heat transfer board 10 includes: a heat transfer board body 1 with a recess 1g on its surface; a tube 3 for a heat medium arranged in the recess 1g and having at least one outer circumference groove 4 extending in a direction perpendicular to a longitudinal direction of the tube; and a lid 2 bonded with the heat transfer body 1 by lidding an opening of the recess 1g where the tube 3 for the heat medium arranged and performing friction stir welding a matching part with the heat transfer body 1.