METHOD FOR APPLYING RELEASE AGENT

PROBLEM TO BE SOLVED: To provide a method for applying a release agent that controls total consumption of a release agent.SOLUTION: The method for applying a release agent sprays an aqueous liquid release agent to a metallic mold by atomizing the agent at the average particle size of 75 μm and the d...

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1. Verfasser: SUGIURA NAOKUNI
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a method for applying a release agent that controls total consumption of a release agent.SOLUTION: The method for applying a release agent sprays an aqueous liquid release agent to a metallic mold by atomizing the agent at the average particle size of 75 μm and the distribution range of 50-100 μm. When the release agent is spayed in the condition, the release agent is spayed while being converted into a mixture of equal parts of mist and particles, meanwhile, when almost all the release agent is spayed in a particle state, a liquid stagnation is more likely to be generated on a surface of the metallic mold. Once a liquid stagnation is generated, which causes the particulate release agent that is sprayed to the liquid stagnation after the generation of the liquid stagnation to be splashed and prevents the particulate release agent from contributing to cooling. Accordingly, the cooling efficiency is not increased. On the contrary, when almost all the release agent is spayed in a mist state, the heat removed from the metallic mold by the vaporization heat effect is reduced, and the cooling efficiency is not increased. The state where mist and particles are mixedly present reasonably (average particle size of 75 μm and distribution range of 50-100 μm), is the intermediate between both states and exhibits the best cooling efficiency than those of both states, therefore the condition is considered preferable.