DIE BOND AGENT AND OPTICAL SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a die bond agent providing a cured material having excellent adhesive strength and workability, and heat resistance, light resistance and crack resistance; and to provide an optical semiconductor device in which an optical semiconductor element is die bonded with the...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	UENO MANABU, WAKAO MIYUKI
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a die bond agent providing a cured material having excellent adhesive strength and workability, and heat resistance, light resistance and crack resistance; and to provide an optical semiconductor device in which an optical semiconductor element is die bonded with the same.SOLUTION: The die bond agent contains 100 parts by mass of (A)(A-1) an organopolysiloxane having (3,5-diglycidylisocyanuryl)alkyl groups at least on both terminals of the main chain, an amount of (B) a curing agent, the amount being such that the equivalent of the reactive group in the (B) component is 0.4 to 1.5 with respect to 1 equivalent of an epoxy group in the (A) component, 350 to 800 parts by mass of (C) a conductive powder having a particle diameter of ≤20 μm at a cumulative frequency of 90% as measured by laser diffractometry, and having a specific surface area of 0.2 to 1.5 m/g with respect to 100 parts by mass of the total of the (A) component and the (B) component, and 0.05 to 3 parts by mass of (D) a curing catalyst with respect to 100 parts by mass of the total of the (A) component and the (B) component.