PREPREG, SUBSTRATE, AND SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a prepreg which has outstanding mechanical strength and durability, a substrate equipped with the prepreg, and a semiconductor device manufactured using the substrate.SOLUTION: The prepreg 1 includes: a fiber base material 2 of a plate shape; a first resin layer 3 wh...

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Bibliographische Detailangaben
Hauptverfasser:	TAKIMOTO KYOJI, HOZUMI TAKESHI, HATANO HARUYUKI
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL PROCESSES OF COMPOUNDING LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING WORKING-UP
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a prepreg which has outstanding mechanical strength and durability, a substrate equipped with the prepreg, and a semiconductor device manufactured using the substrate.SOLUTION: The prepreg 1 includes: a fiber base material 2 of a plate shape; a first resin layer 3 which is located on one surface side of the fiber base material 2, and consists of a first resin composition; and a second resin layer 4 which is located on the other surface side of the fiber base material 2, and consists of a second resin composition. Moreover, in the fiber base material 2, an impregnating part 31 that is impregnated with the first resin composition from the first resin layer 3 is formed in a part of the thickness direction.