LASER BEAM MACHINING METHOD AND DEVICE

PROBLEM TO BE SOLVED: To provide a laser beam machining method and device surely machining an organic substance layer and an adhesive layer.SOLUTION: The laser beam machining method includes: the step of irradiating a flexible printed circuit board 300 in which the organic substance layer and a cond...

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Bibliographische Detailangaben
Hauptverfasser:	NAKAMAE KAZUO, KASHIWASE MASAKAZU, MURASE HIROYASU, MORIYAMA SHUSAKU
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a laser beam machining method and device surely machining an organic substance layer and an adhesive layer.SOLUTION: The laser beam machining method includes: the step of irradiating a flexible printed circuit board 300 in which the organic substance layer and a conductor layer are joined with the adhesive layer with a first pulse laser beam for removing the organic substance layer; and the step of irradiating a workpiece with a second pulse laser beam for removing the adhesive layer after removing the organic substance.