WIRING STRUCTURE, SEMICONDUCTOR ELEMENT, WIRING BOARD, DISPLAY PANEL, AND DISPLAY DEVICE

PROBLEM TO BE SOLVED: To provide a wiring structure which is capable of making a good connection with an oxide electrode, suppressing mutual diffusion occurring at the interface with an insulating film or the like, and reducing costs in a manufacturing process, and to provide a semiconductor element...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	KIMOTO HIDENOBU, NISHIYAMA YUKIHIKO, HARA YOSHIHITO, NAKADA YUKINOBU, IKUTAKE TAKUYA, TERAO YUSUKE
Format:	Patent
Sprache:	eng
Schlagworte:	ADVERTISING BASIC ELECTRIC ELEMENTS CRYPTOGRAPHY DISPLAY DISPLAYING EDUCATION ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY LABELS OR NAME-PLATES PHYSICS SEALS SEMICONDUCTOR DEVICES SIGNS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a wiring structure which is capable of making a good connection with an oxide electrode, suppressing mutual diffusion occurring at the interface with an insulating film or the like, and reducing costs in a manufacturing process, and to provide a semiconductor element, a wiring board, a display panel, and a display device each using this wiring structure.SOLUTION: The wiring structure is a laminate composed of two or more layers including: one selected from a group consisting of an aluminum layer, a copper layer, and a copper alloy layer; and an aluminum alloy layer. The aluminum alloy layer is disposed on a surface layer of the laminate. Accordingly, in a liquid crystal display device or the like, an oxide film is not formed at a connection between the oxide electrode and wiring to allow good connection.