CHIP-LIKE ELECTRONIC COMPONENT AND METHOD OF MOUNTING CHIP-LIKE ELECTRONIC COMPONENT

PROBLEM TO BE SOLVED: To provide a chip-like electronic component and a method of mounting the chip-like electronic component in which even in a component of a narrow pitch, a component or a substrate is not destroyed and measurement can be easily performed without defect in contacting a probe to a...

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Bibliographische Detailangaben
Hauptverfasser:	MIURA YUJI, SHIKI TOMOHIKO, SHIBAZAKI CHUETSU, SADAKANE YASUKAZU, KAWAKAMI TOMOKO, KOKAJI OSAMU, INAKAZU HIROYUKI, TOKUNAGA YUJI, SETO AKIHIKO
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MEASURING MEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES PHYSICS PRINTED CIRCUITS TESTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a chip-like electronic component and a method of mounting the chip-like electronic component in which even in a component of a narrow pitch, a component or a substrate is not destroyed and measurement can be easily performed without defect in contacting a probe to a signal of a target chip-like electronic component terminal.SOLUTION: The present invention relates to a chip-like electronic component to be mounted on an electronic circuit board. The chip-like electronic component has a groove part in an engraving direction on a surface of the electronic circuit board opposed to a surface where the chip-like electronic component is mounted. The groove part is electrically conducted with the mount surface, one terminal of the groove part is opened to a side surface of the chip-like electronic component and the other terminal thereof becomes a wall part.