WHITE CURABLE RESIN COMPOSITION

PROBLEM TO BE SOLVED: To provide a white curable resin composition that can prevent cracks from occurring on a cured film due to punching process, hole-forming process or the like.SOLUTION: The white curable resin composition comprises: an active energy ray-curable resin (A) having at least two ethy...

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Bibliographische Detailangaben
Hauptverfasser:	HASEGAWA YASUYUKI, OKADA NAOKI, TSURUMAKI TAKAHIRO
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY CINEMATOGRAPHY COMPOSITIONS BASED THEREON ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MATERIALS THEREFOR METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a white curable resin composition that can prevent cracks from occurring on a cured film due to punching process, hole-forming process or the like.SOLUTION: The white curable resin composition comprises: an active energy ray-curable resin (A) having at least two ethylenically unsaturated bonds in one molecule; a photoinitiator (B); a diluent (C); titanium oxide (D); an epoxy thermosetting compound (E); and an inorganic compound (F) having an aspect ratio of 5 or larger.