RESIST PATTERN FORMATION METHOD

PROBLEM TO BE SOLVED: To provide a resist pattern formation method for forming a resist pattern having higher adhesion with a supporting body with a method simpler than before.SOLUTION: The resist pattern formation method includes a step (1) for coating a resist composition on a substrate directly,...

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Bibliographische Detailangaben
Hauptverfasser:	MATSUMIYA YU, DAZAI NAOHIRO
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a resist pattern formation method for forming a resist pattern having higher adhesion with a supporting body with a method simpler than before.SOLUTION: The resist pattern formation method includes a step (1) for coating a resist composition on a substrate directly, a step (2) for forming a resist film by baking the substrate on which the resist composition is coated, a step (3) for cleaning the substrate on which the resist film is formed with an organic solvent, and a step (4) for forming a resist pattern by coating the same resist composition as the resist composition coated initially on the substrate after the cleaning.