EXOTHERMIC MODULE AND UNIT OF EXOTHERMIC MODULE

PROBLEM TO BE SOLVED: To provide an exothermic module, which effectively uses a face immersed in a cooling fluid to release heat, and also can show superior cooling performance by adequately setting the cooling fluid at a turbulent state, and to provide a unit of the exothermic module.SOLUTION: An e...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	MANABE KOSUKE, NAKANISHI RAITA, SHIMONAGAYOSHI HIROCHIKA, YAMAGUCHI KAZUYUKI, SETOGUCHI AKIRA
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide an exothermic module, which effectively uses a face immersed in a cooling fluid to release heat, and also can show superior cooling performance by adequately setting the cooling fluid at a turbulent state, and to provide a unit of the exothermic module.SOLUTION: An exothermic module 10 incorporates exothermic bodies 12 and 14, and is cooled by being immersed in a cooler 52 in which the cooling fluid flows toward a predetermined direction. The exothermic module 10 has a front-end 10a having a wedge shape and a back-end 10c having a shape capable of producing a swirling current. In the exothermic module 10, a heating value in a front-end 10a side is lager than that in a back-end 10c side. The exothermic module 10 is arranged so that the front-end 10a is oriented upstream and the back-end 10c is oriented downstream in a flow direction of the cooling fluid.