CONDUCTIVE COPPER PASTE

PROBLEM TO BE SOLVED: To provide a conductive copper paste having a novel structure, which need not use a thermosetting resin component nor glass frit for keeping the adhesion with a base layer and an electrical contact with the base layer, and which is suitable for manufacture of a thick conductor...

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Bibliographische Detailangaben
Hauptverfasser:	ABE SHINTARO, HOSOYA KAZUO, UEDA MASAYUKI, MATSUBA YORISHIGE, HAMADA TAKESHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CABLES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CONDUCTORS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INSULATORS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a conductive copper paste having a novel structure, which need not use a thermosetting resin component nor glass frit for keeping the adhesion with a base layer and an electrical contact with the base layer, and which is suitable for manufacture of a thick conductor layer.SOLUTION: The conductive copper paste is prepared by evenly mixing copper powder, fine copper powder, and a copper salt of aliphatic monocarboxylic acid dissolved in (dialkyl amino)alkylamine together with aliphatic polyhydric alcohol as a dispersion solvent, or prepared by evenly mixing copper powder, fine copper powder, and copper nano particles dispersed in (dialkyl amino)alkylamine together with aliphatic polyhydric alcohol as a dispersion solvent. Use of the conductive copper paste allows the manufacture of a sintered compact layer exhibiting a good electrical conductivity.