URETHANE-BASED MOISTURE-CURABLE ADHESIVE COMPOSITION

PROBLEM TO BE SOLVED: To provide a urethane-based moisture-curable adhesive composition which is not applied with surface treatment such as corona treatment, and favorable in adhesiveness to an olefin-based resin such as PE and PP, and to a polyester-based resin such as PET.SOLUTION: The urethane-ba...

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Bibliographische Detailangaben
Hauptverfasser:	HIGURE HAJIME, KUBOTA IKUO
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON DYES MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a urethane-based moisture-curable adhesive composition which is not applied with surface treatment such as corona treatment, and favorable in adhesiveness to an olefin-based resin such as PE and PP, and to a polyester-based resin such as PET.SOLUTION: The urethane-basd moisture-curable adhesive composition is obtained by making polyester polyol (a1) whose number average molar weight is 2,000 to 6,000, polyether polyol (a2) whose number average molar weight is 1,000 to 3,000 and an isocyanate compound react with one another, and contains an urethane polymer (A) having an isocyanate group at its molecular terminal end, olefin-based polyol (B) whose number average molar weight is 2,000 to 4,000, and whose average functional group number per molecule is in a range of 2 to 5, an aliphatic-group saturated carbon hydride-based viscosity imparting resin (C) whose softening point is 80 to 125°C, and a viscosity imparting resin (D) whose softening point is 100 to 125°C, and which is denatured into a maleic acid.