POLYAMIDE NANOCOMPOSITE

PROBLEM TO BE SOLVED: To provide a novel polyamide (PA) nanocomposite comprising a modified carbon nanofiller (CNF) with good dispersibility, improving mechanical strength of a PA molded product by a small amount of addition thereof while allowing addition in a large amount, and consequently, ensuri...

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Bibliographische Detailangaben
Hauptverfasser:	OKABE YOJI, TAKAI OSAMU, NOJIMA KAZUHIRO, SAITO NAGAHIRO, TSUCHIMOTO AKIHARU, SHIRAFUJI RITSU, HIEDA JUNKO
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS GENERAL PROCESSES OF COMPOUNDING METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS WORKING-UP
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a novel polyamide (PA) nanocomposite comprising a modified carbon nanofiller (CNF) with good dispersibility, improving mechanical strength of a PA molded product by a small amount of addition thereof while allowing addition in a large amount, and consequently, ensuring unconventional mechanical strength and heat resistance.SOLUTION: The PA nanocomposite comprises the modified CNF, wherein the surface is modified by a hydrophilic group, as a reinforcing filler. As the hydrophilic group, an amino group and/or its derivative and/is included at least. The surface modification by the amino group is performed by solution plasma (SP) processing in an aqueous ammonia.