FILM-LIKE ELECTROCONDUCTIVE ADHESIVE

PROBLEM TO BE SOLVED: To provide a film-like electroconductive adhesive which can attain the shortening of a heating pressurizing time without spoiling the connection reliability of the film-like electroconductive adhesive.SOLUTION: The film-like electroconductive adhesive includes: (A) a phenoxy resin having 30,000 or more of a weight-average molecular weight; (B) a liquid epoxy resin having 700 or less of a weight-average molecular weight; (C) a solid epoxy resin having 70-135°C of a softening point; (D) a curing agent in which a microcapsule type latent curing agent which covers an imidazole-based curing agent with a microcapsule is distributed in an epoxy resin containing a liquid epoxy resin which has a naphthalene skeleton; and (E) a conductive particle. The heating pressurizing time can be shortened since the liquid epoxy resin can start curing reaction together with the initiation of heat adhesion. Moreover, a solid epoxy resin can slow the progress of the curing reaction, thereby obtaining the connection reliability.