APPARATUS FOR PROCESSING SUBSTRATE
PROBLEM TO BE SOLVED: To provide a substrate processing apparatus that simultaneously forms thin films on or applies heat treatment to a plurality of substrates, and more particularly, a substrate processing apparatus that can uniformly process a plurality of substrates by uniformly heating the subs...
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creator | PEK WON-BON RA HUNG-YEOL YANG TAE-HOON PARK BYOUNG-KEON CHOI BO-KYONG SOH BYONG-SOO YI GI-YON CHANG JU-NAK IVAN MAJDANCHUK JEONG JIE-WON SEO JIN-WOOK HONG JONG-WON YI GIL-WON PARK CHONG-RYOK LEE DONG-HYUN KANG YU-JIN JEONG YUN-MO JEONG MIN-JIE |
description | PROBLEM TO BE SOLVED: To provide a substrate processing apparatus that simultaneously forms thin films on or applies heat treatment to a plurality of substrates, and more particularly, a substrate processing apparatus that can uniformly process a plurality of substrates by uniformly heating the substrates stacked on a boat disposed in a processing chamber.SOLUTION: A substrate processing apparatus includes: a plurality of substrate holders, each including a substrate support that supports a substrate and a first gas pipe having one or a plurality of injection holes; a boat where the plurality of substrate holders are stacked and including a second gas pipe connected with the first gas pipe; a process chamber providing a space in which the substrates stacked in the boat are processed; a conveying unit that carries the boat into/out of the process chamber; first heating means disposed outside the process chamber; and a gas supply unit including a third gas pipe connected with the second gas pipe and supplying a heated or cooled gas into the second gas pipe. |
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fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2012015476A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2012015476A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2012015476A3</originalsourceid><addsrcrecordid>eNrjZFByDAhwDHIMCQ1WcPMPUggI8nd2DQ729HNXCA51Cg4ByrjyMLCmJeYUp_JCaW4GJTfXEGcP3dSC_PjU4oLE5NS81JJ4rwAjA0MgMjUxN3M0JkoRAJnvIyc</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>APPARATUS FOR PROCESSING SUBSTRATE</title><source>esp@cenet</source><creator>PEK WON-BON ; RA HUNG-YEOL ; YANG TAE-HOON ; PARK BYOUNG-KEON ; CHOI BO-KYONG ; SOH BYONG-SOO ; YI GI-YON ; CHANG JU-NAK ; IVAN MAJDANCHUK ; JEONG JIE-WON ; SEO JIN-WOOK ; HONG JONG-WON ; YI GIL-WON ; PARK CHONG-RYOK ; LEE DONG-HYUN ; KANG YU-JIN ; JEONG YUN-MO ; JEONG MIN-JIE</creator><creatorcontrib>PEK WON-BON ; RA HUNG-YEOL ; YANG TAE-HOON ; PARK BYOUNG-KEON ; CHOI BO-KYONG ; SOH BYONG-SOO ; YI GI-YON ; CHANG JU-NAK ; IVAN MAJDANCHUK ; JEONG JIE-WON ; SEO JIN-WOOK ; HONG JONG-WON ; YI GIL-WON ; PARK CHONG-RYOK ; LEE DONG-HYUN ; KANG YU-JIN ; JEONG YUN-MO ; JEONG MIN-JIE</creatorcontrib><description>PROBLEM TO BE SOLVED: To provide a substrate processing apparatus that simultaneously forms thin films on or applies heat treatment to a plurality of substrates, and more particularly, a substrate processing apparatus that can uniformly process a plurality of substrates by uniformly heating the substrates stacked on a boat disposed in a processing chamber.SOLUTION: A substrate processing apparatus includes: a plurality of substrate holders, each including a substrate support that supports a substrate and a first gas pipe having one or a plurality of injection holes; a boat where the plurality of substrate holders are stacked and including a second gas pipe connected with the first gas pipe; a process chamber providing a space in which the substrates stacked in the boat are processed; a conveying unit that carries the boat into/out of the process chamber; first heating means disposed outside the process chamber; and a gas supply unit including a third gas pipe connected with the second gas pipe and supplying a heated or cooled gas into the second gas pipe.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2012</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20120119&DB=EPODOC&CC=JP&NR=2012015476A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20120119&DB=EPODOC&CC=JP&NR=2012015476A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>PEK WON-BON</creatorcontrib><creatorcontrib>RA HUNG-YEOL</creatorcontrib><creatorcontrib>YANG TAE-HOON</creatorcontrib><creatorcontrib>PARK BYOUNG-KEON</creatorcontrib><creatorcontrib>CHOI BO-KYONG</creatorcontrib><creatorcontrib>SOH BYONG-SOO</creatorcontrib><creatorcontrib>YI GI-YON</creatorcontrib><creatorcontrib>CHANG JU-NAK</creatorcontrib><creatorcontrib>IVAN MAJDANCHUK</creatorcontrib><creatorcontrib>JEONG JIE-WON</creatorcontrib><creatorcontrib>SEO JIN-WOOK</creatorcontrib><creatorcontrib>HONG JONG-WON</creatorcontrib><creatorcontrib>YI GIL-WON</creatorcontrib><creatorcontrib>PARK CHONG-RYOK</creatorcontrib><creatorcontrib>LEE DONG-HYUN</creatorcontrib><creatorcontrib>KANG YU-JIN</creatorcontrib><creatorcontrib>JEONG YUN-MO</creatorcontrib><creatorcontrib>JEONG MIN-JIE</creatorcontrib><title>APPARATUS FOR PROCESSING SUBSTRATE</title><description>PROBLEM TO BE SOLVED: To provide a substrate processing apparatus that simultaneously forms thin films on or applies heat treatment to a plurality of substrates, and more particularly, a substrate processing apparatus that can uniformly process a plurality of substrates by uniformly heating the substrates stacked on a boat disposed in a processing chamber.SOLUTION: A substrate processing apparatus includes: a plurality of substrate holders, each including a substrate support that supports a substrate and a first gas pipe having one or a plurality of injection holes; a boat where the plurality of substrate holders are stacked and including a second gas pipe connected with the first gas pipe; a process chamber providing a space in which the substrates stacked in the boat are processed; a conveying unit that carries the boat into/out of the process chamber; first heating means disposed outside the process chamber; and a gas supply unit including a third gas pipe connected with the second gas pipe and supplying a heated or cooled gas into the second gas pipe.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2012</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFByDAhwDHIMCQ1WcPMPUggI8nd2DQ729HNXCA51Cg4ByrjyMLCmJeYUp_JCaW4GJTfXEGcP3dSC_PjU4oLE5NS81JJ4rwAjA0MgMjUxN3M0JkoRAJnvIyc</recordid><startdate>20120119</startdate><enddate>20120119</enddate><creator>PEK WON-BON</creator><creator>RA HUNG-YEOL</creator><creator>YANG TAE-HOON</creator><creator>PARK BYOUNG-KEON</creator><creator>CHOI BO-KYONG</creator><creator>SOH BYONG-SOO</creator><creator>YI GI-YON</creator><creator>CHANG JU-NAK</creator><creator>IVAN MAJDANCHUK</creator><creator>JEONG JIE-WON</creator><creator>SEO JIN-WOOK</creator><creator>HONG JONG-WON</creator><creator>YI GIL-WON</creator><creator>PARK CHONG-RYOK</creator><creator>LEE DONG-HYUN</creator><creator>KANG YU-JIN</creator><creator>JEONG YUN-MO</creator><creator>JEONG MIN-JIE</creator><scope>EVB</scope></search><sort><creationdate>20120119</creationdate><title>APPARATUS FOR PROCESSING SUBSTRATE</title><author>PEK WON-BON ; RA HUNG-YEOL ; YANG TAE-HOON ; PARK BYOUNG-KEON ; CHOI BO-KYONG ; SOH BYONG-SOO ; YI GI-YON ; CHANG JU-NAK ; IVAN MAJDANCHUK ; JEONG JIE-WON ; SEO JIN-WOOK ; HONG JONG-WON ; YI GIL-WON ; PARK CHONG-RYOK ; LEE DONG-HYUN ; KANG YU-JIN ; JEONG YUN-MO ; JEONG MIN-JIE</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2012015476A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2012</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>PEK WON-BON</creatorcontrib><creatorcontrib>RA HUNG-YEOL</creatorcontrib><creatorcontrib>YANG TAE-HOON</creatorcontrib><creatorcontrib>PARK BYOUNG-KEON</creatorcontrib><creatorcontrib>CHOI BO-KYONG</creatorcontrib><creatorcontrib>SOH BYONG-SOO</creatorcontrib><creatorcontrib>YI GI-YON</creatorcontrib><creatorcontrib>CHANG JU-NAK</creatorcontrib><creatorcontrib>IVAN MAJDANCHUK</creatorcontrib><creatorcontrib>JEONG JIE-WON</creatorcontrib><creatorcontrib>SEO JIN-WOOK</creatorcontrib><creatorcontrib>HONG JONG-WON</creatorcontrib><creatorcontrib>YI GIL-WON</creatorcontrib><creatorcontrib>PARK CHONG-RYOK</creatorcontrib><creatorcontrib>LEE DONG-HYUN</creatorcontrib><creatorcontrib>KANG YU-JIN</creatorcontrib><creatorcontrib>JEONG YUN-MO</creatorcontrib><creatorcontrib>JEONG MIN-JIE</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>PEK WON-BON</au><au>RA HUNG-YEOL</au><au>YANG TAE-HOON</au><au>PARK BYOUNG-KEON</au><au>CHOI BO-KYONG</au><au>SOH BYONG-SOO</au><au>YI GI-YON</au><au>CHANG JU-NAK</au><au>IVAN MAJDANCHUK</au><au>JEONG JIE-WON</au><au>SEO JIN-WOOK</au><au>HONG JONG-WON</au><au>YI GIL-WON</au><au>PARK CHONG-RYOK</au><au>LEE DONG-HYUN</au><au>KANG YU-JIN</au><au>JEONG YUN-MO</au><au>JEONG MIN-JIE</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>APPARATUS FOR PROCESSING SUBSTRATE</title><date>2012-01-19</date><risdate>2012</risdate><abstract>PROBLEM TO BE SOLVED: To provide a substrate processing apparatus that simultaneously forms thin films on or applies heat treatment to a plurality of substrates, and more particularly, a substrate processing apparatus that can uniformly process a plurality of substrates by uniformly heating the substrates stacked on a boat disposed in a processing chamber.SOLUTION: A substrate processing apparatus includes: a plurality of substrate holders, each including a substrate support that supports a substrate and a first gas pipe having one or a plurality of injection holes; a boat where the plurality of substrate holders are stacked and including a second gas pipe connected with the first gas pipe; a process chamber providing a space in which the substrates stacked in the boat are processed; a conveying unit that carries the boat into/out of the process chamber; first heating means disposed outside the process chamber; and a gas supply unit including a third gas pipe connected with the second gas pipe and supplying a heated or cooled gas into the second gas pipe.</abstract><oa>free_for_read</oa></addata></record> |
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subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
title | APPARATUS FOR PROCESSING SUBSTRATE |
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