APPARATUS FOR PROCESSING SUBSTRATE

PROBLEM TO BE SOLVED: To provide a substrate processing apparatus that simultaneously forms thin films on or applies heat treatment to a plurality of substrates, and more particularly, a substrate processing apparatus that can uniformly process a plurality of substrates by uniformly heating the subs...

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Bibliographische Detailangaben
Hauptverfasser: PEK WON-BON, RA HUNG-YEOL, YANG TAE-HOON, PARK BYOUNG-KEON, CHOI BO-KYONG, SOH BYONG-SOO, YI GI-YON, CHANG JU-NAK, IVAN MAJDANCHUK, JEONG JIE-WON, SEO JIN-WOOK, HONG JONG-WON, YI GIL-WON, PARK CHONG-RYOK, LEE DONG-HYUN, KANG YU-JIN, JEONG YUN-MO, JEONG MIN-JIE
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a substrate processing apparatus that simultaneously forms thin films on or applies heat treatment to a plurality of substrates, and more particularly, a substrate processing apparatus that can uniformly process a plurality of substrates by uniformly heating the substrates stacked on a boat disposed in a processing chamber.SOLUTION: A substrate processing apparatus includes: a plurality of substrate holders, each including a substrate support that supports a substrate and a first gas pipe having one or a plurality of injection holes; a boat where the plurality of substrate holders are stacked and including a second gas pipe connected with the first gas pipe; a process chamber providing a space in which the substrates stacked in the boat are processed; a conveying unit that carries the boat into/out of the process chamber; first heating means disposed outside the process chamber; and a gas supply unit including a third gas pipe connected with the second gas pipe and supplying a heated or cooled gas into the second gas pipe.