SEMICONDUCTOR LIGHT EMITTING DEVICE

PROBLEM TO BE SOLVED: To solve a problem that the light emission efficiency of an LED device decreases due to a low reflectance of a Zener diode that is sometimes flip-chip mounted on a circuit board together with an LED element for preventing the LED element from being destructed due to static elec...

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Bibliographische Detailangaben
1. Verfasser:	IMAZU KENJI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To solve a problem that the light emission efficiency of an LED device decreases due to a low reflectance of a Zener diode that is sometimes flip-chip mounted on a circuit board together with an LED element for preventing the LED element from being destructed due to static electricity because there are benefits to improve thermal conductivity, productivity, and a mounting area.SOLUTION: An LED element 13 is flip-chip mounted on an upper surface of a circuit board 12, and a Zener diode 17 is flip-chip mounted on a recess provided on the upper surface of the circuit board 12. The upper surface of the circuit board 12 and the Zener diode 17 are covered with a white ink 18. As a result, the light emission efficiency of an LED device 10 is improved because the reflection loss of the Zener diode 17 is eliminated.