SEMICONDUCTOR MECHANICAL QUANTITY SENSOR

SEMICONDUCTOR MECHANICAL QUANTITY SENSOR

PROBLEM TO BE SOLVED: To reduce a bend of a temperature characteristic of a sensor output offset.SOLUTION: A semiconductor pressure sensor 10 includes: a single crystal silicon substrate 21 having a sensing part 20a; a sensor chip 20 having a glass pedestal 30 supporting a bottom surface of the sing...

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Bibliographische Detailangaben
1. Verfasser: OYA KOJI
Format: Patent
Sprache:eng
Schlagworte:
MEASURING
MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER,MECHANICAL EFFICIENCY, OR FLUID PRESSURE
PHYSICS
TESTING
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To reduce a bend of a temperature characteristic of a sensor output offset.SOLUTION: A semiconductor pressure sensor 10 includes: a single crystal silicon substrate 21 having a sensing part 20a; a sensor chip 20 having a glass pedestal 30 supporting a bottom surface of the single crystal silicon substrate 21; and a ceramic stem 40 supporting a bottom surface of the pedestal 30. A chip adhesive 50 bonding the pedestal 30 and the stem 40 is formed by mixing solid spherical body formed with a material containing a cross-linked polyacrylic acid ester as a main component into fluoro silicon rubber.