PREPREG, METAL-CLAD LAMINATE, AND PRINTED WIRING BOARD

PROBLEM TO BE SOLVED: To provide a prepreg in which inorganic fillers are dispersed uniformly therein, and which can provide a metal-clad laminate excellent in workability and having a low coefficient of thermal expansion despite using aluminum hydroxide together with an inorganic filler such as sil...

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Bibliographische Detailangaben
Hauptverfasser:	YANAGIDA MAKOTO, AITSU SHUJI
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL PROCESSES OF COMPOUNDING LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS WORKING-UP
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a prepreg in which inorganic fillers are dispersed uniformly therein, and which can provide a metal-clad laminate excellent in workability and having a low coefficient of thermal expansion despite using aluminum hydroxide together with an inorganic filler such as silica; and to provide a metal-clad laminate and a printed wiring board.SOLUTION: The prepreg comprises a base material impregnated with a resin composition, and the resin composition includes aluminum hydroxide having mean particle diameter of 2.5-4.5 μm and a glass filler whose SiOcontent is 50-65 mass%, whose mean particle diameter is 1.0-3.0 μm, and whose specific gravity is 2.3-2.6 g/cm. In the prepreg, the total amount of the aluminum hydroxide and the glass filler contained in the solid material of the resin composition is 30-50 mass%. The metal-clad laminate and the printed wiring board are produced by using the prepreg.