SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
PROBLEM TO BE SOLVED: To provide a semiconductor device capable of preventing occurrence of problems caused by, for example, outgas generated from a sealing resin, and to provide a method of manufacturing the same.SOLUTION: A semiconductor device 10 comprises: a substrate 11; electronic components 1...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | PROBLEM TO BE SOLVED: To provide a semiconductor device capable of preventing occurrence of problems caused by, for example, outgas generated from a sealing resin, and to provide a method of manufacturing the same.SOLUTION: A semiconductor device 10 comprises: a substrate 11; electronic components 12 mounted on the substrate 11; a sealing resin 13 sealing the electronic components 12 to be formed on the substrate 11; and a shield layer 14 formed in a reticular pattern in a plan view so as to surround a part of the sealing resin 13. |
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