COOLING STRUCTURE FOR HOUSING DEVICE

PROBLEM TO BE SOLVED: To provide a cooling structure for a housing device having plural slots each capable of housing a plug-in unit, which can suppress reduction in capacity of cooling a slot through which a small quantity of air percolate even when percolating air quantities through the plural slo...

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Bibliographische Detailangaben
Hauptverfasser:	MURAYAMA TETSUYA, SHIRAGAMI TAKASHI, IINO KAZUHIRO, TADA YOSHIAKI, KIRA YUSUKE
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a cooling structure for a housing device having plural slots each capable of housing a plug-in unit, which can suppress reduction in capacity of cooling a slot through which a small quantity of air percolate even when percolating air quantities through the plural slots are different due to structural factors.SOLUTION: The cooling structure for the housing device comprises a baffle part 12 for changing a flowing direction of cooling air discharged from individual slots and partition plates 20 provided in the baffle part 12 at positions corresponding to respective openings of the slots. The cooling structure for the housing device prevents mutual interference of cooling air at the baffle parts 12 discharged from slots by dividing space in the baffle part 12 into plural regions corresponding to individual slots by the partition plates 20, thereby preventing increase in difference of percolating air quantity of each slot.