INSULATING RESIN COMPOSITION AND PRINTED CIRCUIT SUBSTRATE USING THE SAME

PROBLEM TO BE SOLVED: To provide an insulating resin composition containing a soluble fluorine-based resin and a printed circuit board manufactured using the same.SOLUTION: The insulating resin composition includes: a soluble fluorine-based resin; a thermosetting resin; and a solvent capable of simu...

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Bibliographische Detailangaben
Hauptverfasser:	JUNG HYUNGMI, LEE CHOON KEUN, CHO JAE CHOON
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide an insulating resin composition containing a soluble fluorine-based resin and a printed circuit board manufactured using the same.SOLUTION: The insulating resin composition includes: a soluble fluorine-based resin; a thermosetting resin; and a solvent capable of simultaneously dissolving the soluble fluorine-based resin and the thermosetting resin. In addition, the printed circuit board using the same is disclosed.