PATTERNING METHOD AND PATTERNING APPARATUS

PROBLEM TO BE SOLVED: To provide a patterning method and a patterning apparatus which improve throughput and minimize manufacturing cost of a semiconductor device.SOLUTION: The patterning method includes a step for forming a first pattern in a first region on a substrate to be processed, a step for...

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1. Verfasser:	KIYONO YURIKO
Format:	Patent
Sprache:	eng
Schlagworte:	APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MICROSTRUCTURAL TECHNOLOGY PERFORMING OPERATIONS PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS SEMICONDUCTOR DEVICES SPRAYING OR ATOMISING IN GENERAL TRANSPORTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a patterning method and a patterning apparatus which improve throughput and minimize manufacturing cost of a semiconductor device.SOLUTION: The patterning method includes a step for forming a first pattern in a first region on a substrate to be processed, a step for applying a plurality of kinds of block copolymers having different compositions to a second region different from the first region, and a step for forming by heat treatment a second pattern consisting of a plurality of kinds of structures based on the plurality of kinds of block copolymers thus applied.