LAMINATION TYPE PROBE

PROBLEM TO BE SOLVED: To provide a lamination type probe capable of accurately inspecting an electronic device/semiconductor device without difficulty even when a large current of 100 A to 1000 A flows.SOLUTION: In the lamination type probe, a probe contact is formed in a thin sheet; a notch into wh...

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Bibliographische Detailangaben
1. Verfasser:	KIYOTA SHIGEO
Format:	Patent
Sprache:	eng
Schlagworte:	MEASURING MEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES PHYSICS TESTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a lamination type probe capable of accurately inspecting an electronic device/semiconductor device without difficulty even when a large current of 100 A to 1000 A flows.SOLUTION: In the lamination type probe, a probe contact is formed in a thin sheet; a notch into which an elastic body is to be inserted is formed behind a needle part; the probe contact is formed to be rotatable around a rod that is inserted in a first small hole and used as a fulcrum, and is formed, by a rod inserted in a second small hole, to be rotatable only through a prescribed angle; and the probe contact is configured to be movable upward against the force of the elastic body by being held by a holder.