SPUTTERING METHOD, SPUTTER TARGET, SPUTTERING DEVICE AND METHOD FOR MANUFACTURING TARGET

PROBLEM TO BE SOLVED: To provide: a sputtering method that evacuates the inside of a chamber in a short time by a simple manner to perform a sputtering of a substrate; a sputter target; a sputtering device; and a method for manufacturing a target.SOLUTION: The sputtering method includes the steps of...

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Bibliographische Detailangaben
Hauptverfasser:	KOMATSU TORU, MITSUMOTO TETSUJI, MATSUI YOSHITAKA
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide: a sputtering method that evacuates the inside of a chamber in a short time by a simple manner to perform a sputtering of a substrate; a sputter target; a sputtering device; and a method for manufacturing a target.SOLUTION: The sputtering method includes the steps of: arranging a gettering material 1X on a sputter surface of the sputter target; causing the gettering material 1X to be released in the early phase of the sputtering to increase the degree of vacuum; and then executing the sputtering of an object to be sputtered so as to achieve the film formation on the substrate with sputter particles.