ELECTRONIC PART MATERIAL

ELECTRONIC PART MATERIAL

PROBLEM TO BE SOLVED: To provide an electronic part material, in which an Ag-Bi alloy coating film layer having stable quality is formed to a target thickness inexpensively and moreover in high productivity.SOLUTION: In the electronic part material 10, an Ag-Bi alloy plating layer 12 containing Bi14...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: ISEKI SHIGERU, NISHIMURA MASAYASU, MITSUI TOSHIYUKI
Format: Patent
Sprache:eng
Schlagworte:
ALLOYS
APPARATUS THEREFOR
BASIC ELECTRIC ELEMENTS
CHEMISTRY
CURRENT COLLECTORS
ELECTRICITY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
FERROUS OR NON-FERROUS ALLOYS
LINE CONNECTORS
METALLURGY
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
TREATMENT OF ALLOYS OR NON-FERROUS METALS
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide an electronic part material, in which an Ag-Bi alloy coating film layer having stable quality is formed to a target thickness inexpensively and moreover in high productivity.SOLUTION: In the electronic part material 10, an Ag-Bi alloy plating layer 12 containing Bi14 in a content of 0.01-3 atom% is provided on the surface of a base material 11. Thereby, the Ag-Bi alloy coating film layer having stable quality is formed to a target thickness inexpensively and moreover in high productivity. Also, the average thickness of the Ag-Bi alloy plating layer 12 is 0.2-10 μm.