ELECTRONIC EQUIPMENT

PROBLEM TO BE SOLVED: To prevent a void on an end face of mold resin as less as possible by a functional lead at a position away from a gate in molding the mold resin, in a QFP type electronic equipment of a half-mold structure.SOLUTION: On lead terminals 30 positioned on two sides adjacent to each...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	NOMURA TORU, YAMAGISHI TETSUTO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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