ELECTRONIC EQUIPMENT

ELECTRONIC EQUIPMENT

PROBLEM TO BE SOLVED: To prevent a void on an end face of mold resin as less as possible by a functional lead at a position away from a gate in molding the mold resin, in a QFP type electronic equipment of a half-mold structure.SOLUTION: On lead terminals 30 positioned on two sides adjacent to each...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: NOMURA TORU, YAMAGISHI TETSUTO
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To prevent a void on an end face of mold resin as less as possible by a functional lead at a position away from a gate in molding the mold resin, in a QFP type electronic equipment of a half-mold structure.SOLUTION: On lead terminals 30 positioned on two sides adjacent to each other across a first corner part 50a and a second corner part 50b positioned on a diagonal line of mold resin 50, a through hole 31 penetrating from one plate face to the other plate face of the lead terminal 30 is provided so as to be opened from an inner lead part to an outer lead part at a portion positioned on the end face of the mold resin 50 of the lead terminal 30.