MANUFACTURING METHOD OF PACKAGE, PACKAGE, PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC APPARATUS, AND RADIO-CONTROLLED WATCH
PROBLEM TO BE SOLVED: To provide a manufacturing method of a package, a package, a piezoelectric vibrator, an oscillator, an electronic apparatus, and a radio-controlled watch capable of improving a yield by reducing warpage of a first substrate and improving mechanical strength of the package.SOLUT...
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| creator | FUNABIKI YOICHI |
| description | PROBLEM TO BE SOLVED: To provide a manufacturing method of a package, a package, a piezoelectric vibrator, an oscillator, an electronic apparatus, and a radio-controlled watch capable of improving a yield by reducing warpage of a first substrate and improving mechanical strength of the package.SOLUTION: A first polishing process polishes surfaces of a wafer 40 for a base substrate until surface roughness of a second surface 40b becomes lower than that of a first surface 40a. A second polishing process exposes a metal pin 37 on the second surface 40b and polishes surfaces until the surface roughness of the first surface 40a is the same as that of the second surface 40b. |
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| subjects | BASIC ELECTRIC ELEMENTS BASIC ELECTRONIC CIRCUITRY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS RESONATORS SEMICONDUCTOR DEVICES |
| title | MANUFACTURING METHOD OF PACKAGE, PACKAGE, PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC APPARATUS, AND RADIO-CONTROLLED WATCH |
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