MANUFACTURING METHOD OF PACKAGE, PACKAGE, PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC APPARATUS, AND RADIO-CONTROLLED WATCH

MANUFACTURING METHOD OF PACKAGE, PACKAGE, PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC APPARATUS, AND RADIO-CONTROLLED WATCH

PROBLEM TO BE SOLVED: To provide a manufacturing method of a package, a package, a piezoelectric vibrator, an oscillator, an electronic apparatus, and a radio-controlled watch capable of improving a yield by reducing warpage of a first substrate and improving mechanical strength of the package.SOLUT...

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Bibliographische Detailangaben
1. Verfasser: FUNABIKI YOICHI
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
BASIC ELECTRONIC CIRCUITRY
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS
RESONATORS
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a manufacturing method of a package, a package, a piezoelectric vibrator, an oscillator, an electronic apparatus, and a radio-controlled watch capable of improving a yield by reducing warpage of a first substrate and improving mechanical strength of the package.SOLUTION: A first polishing process polishes surfaces of a wafer 40 for a base substrate until surface roughness of a second surface 40b becomes lower than that of a first surface 40a. A second polishing process exposes a metal pin 37 on the second surface 40b and polishes surfaces until the surface roughness of the first surface 40a is the same as that of the second surface 40b.