PIEZOELECTRIC DEVICE

PROBLEM TO BE SOLVED: To provide a piezoelectric device that has a first plate and a second plate bonded together by use of an adhesive and sealing glass, has excellent bonding strength and maintains vacuum and proper humidity in a cavity.SOLUTION: A piezoelectric device 100A includes: a piezoelectr...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: UMEKI SATOSHI
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator UMEKI SATOSHI
description PROBLEM TO BE SOLVED: To provide a piezoelectric device that has a first plate and a second plate bonded together by use of an adhesive and sealing glass, has excellent bonding strength and maintains vacuum and proper humidity in a cavity.SOLUTION: A piezoelectric device 100A includes: a piezoelectric resonator chip 10 that vibrates upon application of a voltage; a first plate 12A that has a depression 121 for storing the piezoelectric resonator chip 10 and an end face M2 formed around the depression 121; and a second plate 11A bonded to the end face M2 with a sealing member SL so as to seal the piezoelectric resonator chip 10. The sealing member SL includes sealing glass films g1, g2, and g3 and adhesives p1 and p2 that are arranged in circular patterns so as to circle around the end face M2.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2011250227A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2011250227A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2011250227A3</originalsourceid><addsrcrecordid>eNrjZBAJ8HSN8nf1cXUOCfJ0VnBxDfN0duVhYE1LzClO5YXS3AxKbq4hzh66qQX58anFBYnJqXmpJfFeAUYGhoZGpgZGRuaOxkQpAgC2wR79</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>PIEZOELECTRIC DEVICE</title><source>esp@cenet</source><creator>UMEKI SATOSHI</creator><creatorcontrib>UMEKI SATOSHI</creatorcontrib><description>PROBLEM TO BE SOLVED: To provide a piezoelectric device that has a first plate and a second plate bonded together by use of an adhesive and sealing glass, has excellent bonding strength and maintains vacuum and proper humidity in a cavity.SOLUTION: A piezoelectric device 100A includes: a piezoelectric resonator chip 10 that vibrates upon application of a voltage; a first plate 12A that has a depression 121 for storing the piezoelectric resonator chip 10 and an end face M2 formed around the depression 121; and a second plate 11A bonded to the end face M2 with a sealing member SL so as to seal the piezoelectric resonator chip 10. The sealing member SL includes sealing glass films g1, g2, and g3 and adhesives p1 and p2 that are arranged in circular patterns so as to circle around the end face M2.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; BASIC ELECTRONIC CIRCUITRY ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS ; RESONATORS ; SEMICONDUCTOR DEVICES</subject><creationdate>2011</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20111208&amp;DB=EPODOC&amp;CC=JP&amp;NR=2011250227A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20111208&amp;DB=EPODOC&amp;CC=JP&amp;NR=2011250227A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>UMEKI SATOSHI</creatorcontrib><title>PIEZOELECTRIC DEVICE</title><description>PROBLEM TO BE SOLVED: To provide a piezoelectric device that has a first plate and a second plate bonded together by use of an adhesive and sealing glass, has excellent bonding strength and maintains vacuum and proper humidity in a cavity.SOLUTION: A piezoelectric device 100A includes: a piezoelectric resonator chip 10 that vibrates upon application of a voltage; a first plate 12A that has a depression 121 for storing the piezoelectric resonator chip 10 and an end face M2 formed around the depression 121; and a second plate 11A bonded to the end face M2 with a sealing member SL so as to seal the piezoelectric resonator chip 10. The sealing member SL includes sealing glass films g1, g2, and g3 and adhesives p1 and p2 that are arranged in circular patterns so as to circle around the end face M2.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>BASIC ELECTRONIC CIRCUITRY</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS</subject><subject>RESONATORS</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2011</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBAJ8HSN8nf1cXUOCfJ0VnBxDfN0duVhYE1LzClO5YXS3AxKbq4hzh66qQX58anFBYnJqXmpJfFeAUYGhoZGpgZGRuaOxkQpAgC2wR79</recordid><startdate>20111208</startdate><enddate>20111208</enddate><creator>UMEKI SATOSHI</creator><scope>EVB</scope></search><sort><creationdate>20111208</creationdate><title>PIEZOELECTRIC DEVICE</title><author>UMEKI SATOSHI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2011250227A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2011</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>BASIC ELECTRONIC CIRCUITRY</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS</topic><topic>RESONATORS</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>UMEKI SATOSHI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>UMEKI SATOSHI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>PIEZOELECTRIC DEVICE</title><date>2011-12-08</date><risdate>2011</risdate><abstract>PROBLEM TO BE SOLVED: To provide a piezoelectric device that has a first plate and a second plate bonded together by use of an adhesive and sealing glass, has excellent bonding strength and maintains vacuum and proper humidity in a cavity.SOLUTION: A piezoelectric device 100A includes: a piezoelectric resonator chip 10 that vibrates upon application of a voltage; a first plate 12A that has a depression 121 for storing the piezoelectric resonator chip 10 and an end face M2 formed around the depression 121; and a second plate 11A bonded to the end face M2 with a sealing member SL so as to seal the piezoelectric resonator chip 10. The sealing member SL includes sealing glass films g1, g2, and g3 and adhesives p1 and p2 that are arranged in circular patterns so as to circle around the end face M2.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_epo_espacenet_JP2011250227A
source esp@cenet
subjects BASIC ELECTRIC ELEMENTS
BASIC ELECTRONIC CIRCUITRY
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS
RESONATORS
SEMICONDUCTOR DEVICES
title PIEZOELECTRIC DEVICE
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-01T16%3A48%3A18IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=UMEKI%20SATOSHI&rft.date=2011-12-08&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJP2011250227A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true