PIEZOELECTRIC DEVICE

PROBLEM TO BE SOLVED: To provide a piezoelectric device that has a first plate and a second plate bonded together by use of an adhesive and sealing glass, has excellent bonding strength and maintains vacuum and proper humidity in a cavity.SOLUTION: A piezoelectric device 100A includes: a piezoelectr...

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Bibliographische Detailangaben
1. Verfasser:	UMEKI SATOSHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS BASIC ELECTRONIC CIRCUITRY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS RESONATORS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a piezoelectric device that has a first plate and a second plate bonded together by use of an adhesive and sealing glass, has excellent bonding strength and maintains vacuum and proper humidity in a cavity.SOLUTION: A piezoelectric device 100A includes: a piezoelectric resonator chip 10 that vibrates upon application of a voltage; a first plate 12A that has a depression 121 for storing the piezoelectric resonator chip 10 and an end face M2 formed around the depression 121; and a second plate 11A bonded to the end face M2 with a sealing member SL so as to seal the piezoelectric resonator chip 10. The sealing member SL includes sealing glass films g1, g2, and g3 and adhesives p1 and p2 that are arranged in circular patterns so as to circle around the end face M2.