PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

PROBLEM TO BE SOLVED: To provide a printed circuit board, which can improve heat radiation performance and can prevent an electric short circuit from occurring between a circuit wiring of a circuit layer formed on the printed circuit board because a sol-gel layer is formed between the circuit wiring of the circuit layer and which can increase the heat radiation effect because an anodic oxide layer is removed from that one side of a metal substrate on which the a circuit layer is not provided, and to provide a method of manufacturing the same.SOLUTION: A printed circuit board according to the present invention includes: a metal substrate 10; an anodic oxide layer 20 formed by anodizing the metal substrate 10; circuit layers 30, 31 formed on the anodic oxide layer 20; and a first sol-gel layer 50 formed by applying a photocatalytic material between circuit wiring of the circuit layers 30, 31, in which photocatalytic material is exposed, and then curing the applied photocatalytic material.