SUBSTRATE CONNECTION STRUCTURE AND ELECTRONIC DEVICE

PROBLEM TO BE SOLVED: To provide a substrate connection structure and an electric device capable of securing cooling performance to a device while saving space.SOLUTION: The substrate connection structure connects a plurality of circuit boards and includes: the plurality of circuit boards; a connect...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: KAWADA ATSUMI, TAKAHIRA MITSURU, WAKAYAMA NOBUHIKO
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a substrate connection structure and an electric device capable of securing cooling performance to a device while saving space.SOLUTION: The substrate connection structure connects a plurality of circuit boards and includes: the plurality of circuit boards; a connection substrate arranged horizontally to a passage of cooling air discharged from an air blowing part to connect the circuit boards to each other; and a connector part which connects each of the plurality of circuit boards to the connection substrate. Each of the circuit boards and the connection substrate are arranged on the same plane.