SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide means for securing joint strength in stitch bonding of wire bonding and enhancing joint reliability.SOLUTION: In stitch bonding (2nd bonding) of wire bonding, the thickness of a stitch portion 5a can be controlled by controlling the height of a capillary 6e, so that...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: SUMITOMO KAORI, HORIBE HIROSHI, TAKADA YASUNORI, SHINKAWA HIDEYUKI
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator SUMITOMO KAORI
HORIBE HIROSHI
TAKADA YASUNORI
SHINKAWA HIDEYUKI
description PROBLEM TO BE SOLVED: To provide means for securing joint strength in stitch bonding of wire bonding and enhancing joint reliability.SOLUTION: In stitch bonding (2nd bonding) of wire bonding, the thickness of a stitch portion 5a can be controlled by controlling the height of a capillary 6e, so that the joint strength can be secured and joint reliability can be enhanced. The stitch portion 5a has a thickness part 5e, and a part (α portion) of a joint area 5b between a wire 5 and an inner lead 2a is formed at the lower portion of the thickness part 5e, so that the thickness of the stitch portion 5a and the joint area 5b can be sufficiently secured.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2011249724A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2011249724A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2011249724A3</originalsourceid><addsrcrecordid>eNrjZHAKdvX1dPb3cwl1DvEPUnBxDfN0dlXwdfQLdXN0DgkN8vRzV_B1DfHwd1Fw9HNRwKaah4E1LTGnOJUXSnMzKLm5hjh76KYW5MenFhckJqfmpZbEewUYGRgaGplYmhuZOBoTpQgAeDor4w</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE</title><source>esp@cenet</source><creator>SUMITOMO KAORI ; HORIBE HIROSHI ; TAKADA YASUNORI ; SHINKAWA HIDEYUKI</creator><creatorcontrib>SUMITOMO KAORI ; HORIBE HIROSHI ; TAKADA YASUNORI ; SHINKAWA HIDEYUKI</creatorcontrib><description>PROBLEM TO BE SOLVED: To provide means for securing joint strength in stitch bonding of wire bonding and enhancing joint reliability.SOLUTION: In stitch bonding (2nd bonding) of wire bonding, the thickness of a stitch portion 5a can be controlled by controlling the height of a capillary 6e, so that the joint strength can be secured and joint reliability can be enhanced. The stitch portion 5a has a thickness part 5e, and a part (α portion) of a joint area 5b between a wire 5 and an inner lead 2a is formed at the lower portion of the thickness part 5e, so that the thickness of the stitch portion 5a and the joint area 5b can be sufficiently secured.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2011</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20111208&amp;DB=EPODOC&amp;CC=JP&amp;NR=2011249724A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20111208&amp;DB=EPODOC&amp;CC=JP&amp;NR=2011249724A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SUMITOMO KAORI</creatorcontrib><creatorcontrib>HORIBE HIROSHI</creatorcontrib><creatorcontrib>TAKADA YASUNORI</creatorcontrib><creatorcontrib>SHINKAWA HIDEYUKI</creatorcontrib><title>SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE</title><description>PROBLEM TO BE SOLVED: To provide means for securing joint strength in stitch bonding of wire bonding and enhancing joint reliability.SOLUTION: In stitch bonding (2nd bonding) of wire bonding, the thickness of a stitch portion 5a can be controlled by controlling the height of a capillary 6e, so that the joint strength can be secured and joint reliability can be enhanced. The stitch portion 5a has a thickness part 5e, and a part (α portion) of a joint area 5b between a wire 5 and an inner lead 2a is formed at the lower portion of the thickness part 5e, so that the thickness of the stitch portion 5a and the joint area 5b can be sufficiently secured.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2011</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHAKdvX1dPb3cwl1DvEPUnBxDfN0dlXwdfQLdXN0DgkN8vRzV_B1DfHwd1Fw9HNRwKaah4E1LTGnOJUXSnMzKLm5hjh76KYW5MenFhckJqfmpZbEewUYGRgaGplYmhuZOBoTpQgAeDor4w</recordid><startdate>20111208</startdate><enddate>20111208</enddate><creator>SUMITOMO KAORI</creator><creator>HORIBE HIROSHI</creator><creator>TAKADA YASUNORI</creator><creator>SHINKAWA HIDEYUKI</creator><scope>EVB</scope></search><sort><creationdate>20111208</creationdate><title>SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE</title><author>SUMITOMO KAORI ; HORIBE HIROSHI ; TAKADA YASUNORI ; SHINKAWA HIDEYUKI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2011249724A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2011</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>SUMITOMO KAORI</creatorcontrib><creatorcontrib>HORIBE HIROSHI</creatorcontrib><creatorcontrib>TAKADA YASUNORI</creatorcontrib><creatorcontrib>SHINKAWA HIDEYUKI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SUMITOMO KAORI</au><au>HORIBE HIROSHI</au><au>TAKADA YASUNORI</au><au>SHINKAWA HIDEYUKI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE</title><date>2011-12-08</date><risdate>2011</risdate><abstract>PROBLEM TO BE SOLVED: To provide means for securing joint strength in stitch bonding of wire bonding and enhancing joint reliability.SOLUTION: In stitch bonding (2nd bonding) of wire bonding, the thickness of a stitch portion 5a can be controlled by controlling the height of a capillary 6e, so that the joint strength can be secured and joint reliability can be enhanced. The stitch portion 5a has a thickness part 5e, and a part (α portion) of a joint area 5b between a wire 5 and an inner lead 2a is formed at the lower portion of the thickness part 5e, so that the thickness of the stitch portion 5a and the joint area 5b can be sufficiently secured.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_epo_espacenet_JP2011249724A
source esp@cenet
subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-30T07%3A23%3A59IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=SUMITOMO%20KAORI&rft.date=2011-12-08&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJP2011249724A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true