SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide means for securing joint strength in stitch bonding of wire bonding and enhancing joint reliability.SOLUTION: In stitch bonding (2nd bonding) of wire bonding, the thickness of a stitch portion 5a can be controlled by controlling the height of a capillary 6e, so that...

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Bibliographische Detailangaben
Hauptverfasser:	SUMITOMO KAORI, HORIBE HIROSHI, TAKADA YASUNORI, SHINKAWA HIDEYUKI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide means for securing joint strength in stitch bonding of wire bonding and enhancing joint reliability.SOLUTION: In stitch bonding (2nd bonding) of wire bonding, the thickness of a stitch portion 5a can be controlled by controlling the height of a capillary 6e, so that the joint strength can be secured and joint reliability can be enhanced. The stitch portion 5a has a thickness part 5e, and a part (α portion) of a joint area 5b between a wire 5 and an inner lead 2a is formed at the lower portion of the thickness part 5e, so that the thickness of the stitch portion 5a and the joint area 5b can be sufficiently secured.