SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

PROBLEM TO BE SOLVED: To provide a semiconductor device which can maintain a constant interval between two wiring boards sandwiching a semiconductor chip and can determine the bonding positions of the two wiring boards with high accuracy, and to provide a manufacturing method thereof.SOLUTION: A fir...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: YOSHIMI DAISUKE, SHIMOIKE SHOICHIRO
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a semiconductor device which can maintain a constant interval between two wiring boards sandwiching a semiconductor chip and can determine the bonding positions of the two wiring boards with high accuracy, and to provide a manufacturing method thereof.SOLUTION: A first wiring board 10 mounting a semiconductor chip and a second wiring board 20 are provided, respectively, with a first hole 11 and a second hole 21 facing each other. Metal balls 30 are then placed in these holes and the contact parts of the first and second wiring boards 10, 20 and the metal balls 30 are bonded each other.