SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

PROBLEM TO BE SOLVED: To provide a semiconductor device allows crystal defects in an element region to be suppressed and capable of readily improving the accuracy of dicing and breaking, and to provide a method of manufacturing the same.SOLUTION: A semiconductor device comprises a principal surface...

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Bibliographische Detailangaben
1. Verfasser: KUNIHIRO TAKASHI
Format: Patent
Sprache:eng
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