METHOD FOR MANUFACTURING METALLIZED RESIN FILM SUBSTRATE

PROBLEM TO BE SOLVED: To provide a method for manufacturing a metallized resin film substrate, improving productivity of a double-layer metallized resin film substrate used as a flexible wiring board, and simultaneously achieving dimensional stability and elimination of discoloration such as a stain...

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Bibliographische Detailangaben
1. Verfasser:	OCHI HITOSHI
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS THEREFOR CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM METALLURGY PERFORMING OPERATIONS PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION TRANSPORTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a method for manufacturing a metallized resin film substrate, improving productivity of a double-layer metallized resin film substrate used as a flexible wiring board, and simultaneously achieving dimensional stability and elimination of discoloration such as a stain.SOLUTION: When a plurality of feeding rolls 6a-6d feed to a metal thin film to electroplate a surface of the metal thin film while a resin film F with the metal thin film is repeatedly immersed in a plating liquid 4 to be conveyed, a plating liquid or water at a temperature of 10-32°C is sprayed, between each of the feeding rolls 6a-6d and a liquid level of the plating liquid 4, on a surface of the resin film F with the metal thin film, wherein the surface does not face anodes 8a-1, 8a-2, 8b-1, 8b-2, 8c-1, 8c-2, 8d-1 and 8d-2.