THERMOPLASTIC RESIN COMPOSITION, MOLDING THEREOF, AND METHOD FOR MOLDING THE SAME

PROBLEM TO BE SOLVED: To provide a resin composition having high melt strength and excellent molding processability; and a molding having excellent appearance obtained by molding the composition.SOLUTION: This thermoplastic composition includes (A) 100 pts.wt. of a polymer having ≥10,000 to less tha...

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Hauptverfasser:	SATO MITSUTAKE, KANDA SUEHIKO, TOKIMOTO HIROOMI
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS GENERAL PROCESSES OF COMPOUNDING INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL WORKING-UP
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a resin composition having high melt strength and excellent molding processability; and a molding having excellent appearance obtained by molding the composition.SOLUTION: This thermoplastic composition includes (A) 100 pts.wt. of a polymer having ≥10,000 to less than 1,000,000 weight-average molecular weight, (B1) 0.5-15 pts.wt. of a polymer having ≥1,000,000 to less than 10,000,000 weight-average molecular weight, and having 10-1,000 carboxy groups in the molecule, (B2) 0.5-15 pts.wt. of a polymer having ≥1,000,000 to less than 5,000,000 weight-average molecular weight, and having 1 or 2 hydroxy groups in the molecule, and (C) 0.1-5 pts.wt. of a condensation agent.