THERMAL DISSIPATION DEVICE FOR SPACE EQUIPMENT, IN PARTICULAR FOR SPACE SATELLITE

PROBLEM TO BE SOLVED: To provide a thermal dissipation device for space equipment, in particular, for a space satellite.SOLUTION: The heat dissipation device for a space satellite includes at least one heat dissipation panel 11 having at least one film 212, 211 composed of a composite structure cont...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: CHAIX ALAIN, LUTZ MARTINE, MONTREDON FLORENCE, VITUPIER YANN, LALANDE HUBERT
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a thermal dissipation device for space equipment, in particular, for a space satellite.SOLUTION: The heat dissipation device for a space satellite includes at least one heat dissipation panel 11 having at least one film 212, 211 composed of a composite structure containing an organic resin and carbon fiber, in which the organic resin is filled with carbon nanotubes. The heat dissipation device can include a network of heat pipes 21. The heat pipe 21 can be formed of an aluminum alloy in which an element having a low coefficient of thermal expansion is mixed. The present invention is particularly applicable to a fixed heat dissipation panel, or a heat dissipation panel 11 used in a communication satellite, an observational satellite or a scientific satellite, or a rack coupled to a heat dissipation panel.