LAPPING CARRIER

PROBLEM TO BE SOLVED: To drill holes in a circumferential part of a work hole to reduce a horizontal stress to be applied to a workpiece mounted on the work hole, without installing an elastic body on the inner circumferential surface of the work hole, thereby reducing defects.SOLUTION: A plurality...

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Bibliographische Detailangaben
Hauptverfasser:	TOMURO YASUSHI, YABE HAJIME, SEKINE HISASHI
Format:	Patent
Sprache:	eng
Schlagworte:	DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING TRANSPORTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To drill holes in a circumferential part of a work hole to reduce a horizontal stress to be applied to a workpiece mounted on the work hole, without installing an elastic body on the inner circumferential surface of the work hole, thereby reducing defects.SOLUTION: A plurality of work holes 4 of a desired shape are formed in a lapping carrier body 2. One or a plurality of through holes 6 are formed along the circumference of the work holes 4. A frame body 7 and support bodies 8 supporting the frame body 7 are disposed in the through hole 6 by machining the through holes 6. A spring action is added by a structure of the support bodies 8 to reduce the horizontal stress to be applied to the workpiece.