SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To examine the internal stress that affects a conductive film in a semiconductor device.SOLUTION: In the semiconductor device comprising an n-channel MOSFET formed on a single crystal silicon substrate, impurities are introduced to a conductive film so that a channel formation...

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1. Verfasser: ARAO TATSUYA
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To examine the internal stress that affects a conductive film in a semiconductor device.SOLUTION: In the semiconductor device comprising an n-channel MOSFET formed on a single crystal silicon substrate, impurities are introduced to a conductive film so that a channel formation region is subjected to tensile stress. In the semiconductor device comprising a p-channel MOSFET formed on the single crystal silicon substrate, the impurities are introduced to the conductive film so that the channel formation region is subjected to compression stress.