SEMICONDUCTOR DEVICE
PROBLEM TO BE SOLVED: To examine the internal stress that affects a conductive film in a semiconductor device.SOLUTION: In the semiconductor device comprising an n-channel MOSFET formed on a single crystal silicon substrate, impurities are introduced to a conductive film so that a channel formation...
Gespeichert in:
1. Verfasser: | |
---|---|
Format: | Patent |
Sprache: | eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | PROBLEM TO BE SOLVED: To examine the internal stress that affects a conductive film in a semiconductor device.SOLUTION: In the semiconductor device comprising an n-channel MOSFET formed on a single crystal silicon substrate, impurities are introduced to a conductive film so that a channel formation region is subjected to tensile stress. In the semiconductor device comprising a p-channel MOSFET formed on the single crystal silicon substrate, the impurities are introduced to the conductive film so that the channel formation region is subjected to compression stress. |
---|