ULTRASONIC MOUNTING TOOL AND ELECTRONIC COMPONENTS MOUNTING DEVICE

PROBLEM TO BE SOLVED: To provide an ultrasonic mounting tool of which a suction hole for adsorbing and holding an electronic component can be easily formed on the ventral portion of a horn for generating ultrasonic vibration.SOLUTION: The ultrasonic mounting tool comprises: an oscillator 23 that is...

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Bibliographische Detailangaben
Hauptverfasser:	TASUMIISHI TOSHINARI, HERAI MASAYASU, HORIUCHI SHINJI, MATSUNO MASAHISA
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide an ultrasonic mounting tool of which a suction hole for adsorbing and holding an electronic component can be easily formed on the ventral portion of a horn for generating ultrasonic vibration.SOLUTION: The ultrasonic mounting tool comprises: an oscillator 23 that is provided at one end of a horn 22 and oscillates the horn in the specified direction; a tool part 25 that is provided in a portion at which maximum amplitude of the vibration of the horn is obtained and of which the tip of a suction hole 31 for adsorbing and holding a semiconductor chip C has an opening at the bottom surface. The suction hole is formed to penetrate straight along the vertical direction intersecting the oscillation direction of the horn.